New Texas Instruments (TI) semiconductor facility in Lehi made possible by the Romney-backed CHIPS and Science Act
U.S. Senator Mitt Romney (R-UT) today applauded an announcement by Texas Instruments Incorporated (TI) that it has selected Lehi, Utah, for its next 300-millimeter semiconductor wafer fabrication plant (or fab). This landmark $11 billion investment marks the largest economic investment in Utah history, and was made possible by the passage of the Romney-backed CHIPS and Science Act. Romney supported the CHIPS and Science Act to advance and solidify the United States’ leadership in scientific and technological innovation through increased investments in the discovery, creation, and manufacturing of technology critical to U.S. national security and economic competitiveness.
“Utah continues to be a great place to do business, and today’s announcement further proves that,” Senator Romney said. “I was proud to support the legislation that made this historic investment in our state possible, which will strengthen our country’s manufacturing capabilities and help break U.S. dependence on China for microchips. Texas Instruments’ new facility will also bring hundreds of jobs to Lehi and the surrounding area. We must continue to promote innovation, foster scientific talent, and expand U.S. research if we are going to compete with China on the world stage, and today’s announcement is a strong step in the right direction.”
The landmark $11 billion investment marks the largest economic investment in Utah history. The Lehi expansion will create approximately 800 additional TI jobs, as well as thousands of indirect jobs. TI will continue to strengthen its partnership with the Alpine School District and will invest $9 million to improve student opportunities and outcomes.
The new fab will be located next to the company’s existing 300-mm semiconductor wafer fab in Lehi. Construction of the new fab is expected to begin in the second half of 2023, with production as early as 2026.
Lehi is an ideal location because of its access to skilled talent, robust existing infrastructure and strong network of community partners. The new fab will manufacture tens of millions of analog and embedded processing chips daily that will go into electronics everywhere.
The fab will be designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold. Plans include recycling water at nearly double the rate of the existing Lehi fab. Advanced 300-mm equipment and processes in Lehi will further reduce waste, water and energy consumption per chip.